TCT ASIA

19 - 21 FEBRUARY 2020

SNIEC, SHANGHAI,CHINA

REGISTER

TCT ASIA SUMMIT

WORKSHOPS

February 21 15:00 pm -15:30 pm

Topic: Multiple-Materials 3D Printing for Structural Electronics

Outline:

1. Three-dimensional (3D) printing is a next-generation free-form manufacturing technology for structural electronics.

2. We demonstrate a novel strategy for multiple-materials 3D printing at room temperature in ambient air conditions.

3. Functional 3D micro- and nanoarchitectures are printed with inks such as graphene, carbon nanotube (CNT), metal oxide, metal and even their

 composite.

4. Several structural electronic applications are successfully demonstrated by multiple-materials 3D printing approach.


Speaker's Biography:

Seung Kwon Seol received a Ph.D. from the Pohang University of Science and Technology (POSTECH), Korea, in 2008. He has been affiliated with Korea Electrotechnology Research Institute (KERI) since 2008. He also has been working as professor in the University of Science and Technology (UST) since 2012. He has strong experience in the synthesis of nanomaterials and the material analysis by X-rays. He is currently focused on 3D printing of multiple-materials micro/nanostructures with smart inks as well as implementation of 3D printed electronics.  

Seung Kwon, Seol

Seung Kwon, Seol

Korea Electro Technology Research Institute

Topic: Multiple-Materials 3D Printing for Structural Electronics

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